Publications on Our Straining Technique


Patents

  1. US Patent 6,514,836 B2 "Method of Producing Strained Microelectronic and/or Optical Integrated and Discrete Devices", Rona E. Belford, Feb 2003.
     
  2. US Patent 6,455,397 B1, "Method of Producing Strained Microelectronic and/or Optical Integrated and Discrete Devices", Rona E. Belford, Sept 2002.

Magazine Articles

  1. Rona Belford, "A New Slant on Strain", Web Exclusive featured Article, Semiconductor International Magazine, 1st Oct 2006.
     
  2. Rona Belford, "Smart mechanical strain techniques to improve device performance", featured Article, Semiconductor Manufacturing Magazine, Sep 2006.
     
  3. Sumant Sood and Tony Acosta, "Engineering Strained Silicon- Looking Back And Into The Future", IEEE Potentials Magazine, July 2006.
     
  4. Rona E. Belford featured in "Silicon Takes the Strain", IEE Review special report on Microelectronics Dec 2003.

Publications

  1.  Rona Belford and Sumant Sood, "Surface activation using remote plasma for silicon to quartz wafer bonding", Microsystem Technologies: Vol. 15(3), 407 (2009).
     
  2.  Rona Belford and Sumant Sood, "Surface Activation Using Remote Plasma for Hydrophilic Bonding at Elevated Temperature", Electrochemical and Solid State Letters, Vol.100(5), (2007).
     
  3. Sumant Sood and Rona Belford, "Strained silicon via plasma enhanced dCTE bonding", ECS Transactions, Vol. 3 (6), 99-106, (2006).
     
  4. R. E. Belford, B. P. Guo, Q. Xu, S. Sood, A. A. Thrift, A. Teren, A. Acosta, L. A. Bosworth, and J. S. Zell ;"Strain enhanced p-type metal oxide semiconductor field effect transistors ". Journal of Applied Physics, 100, 064903 (2006).
     
  5. Sumant Sood and Rona Belford, "Surface Activation Using Remote Plasma for a New Wafer Bonding Route to Strained-Si ",; ECS Transactions, Vol. 2 (4), 23-29, (2006).
     
  6. B. M. Haugerud, M.B. Nayeem, R. Krithivasan, Lu Yuan Zhu Chendong, J. D. Cressler, R. E. Belford and A. J. Joseph;"The effects of mechanical planar biaxial strain in Si/SiGe HBT BiCMOS technology", Solid-State Electron.(UK). Vol.49, No.6, pp 986-90, (2005).
     
  7. B. M. Haugerud, L. A. Bosworth and R. E. Belford, "Elevated-Temperature Electrical Characteristics of Mechanically Strained-Si Devices" Journal of Applied Physics, Vol. 95, No. 1 pp 2792-2796, (2004).
     
  8. Wei Zhao, Jianli He, Rona Belford, Lars-Erik Wernersson, and Alan Seabaugh, "Partially-Depleted SOI MOSFETs Under Uniaxial Tensile Strain" IEEE Transactions on Electron Devices, Vol. 51, No. 3, pp 317-323, (2004).
     
  9. M. B. Nayeem, B. M Haugerud, R. Krithivasan, C. Zhu, R. E. Belford, J. D. Cressler, and A. J. Joseph, “Mechanical Planar Biaxial Strain Effects in Si/SiGe HBT BiCMOS Technology,” Proceedings of the 2004 IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, pp. 103-106, (2004).
     
  10. B. M. Haugerud, L. A. Bosworth and R. E. Belford, "Mechanically Induced Strain Enhancement of Metal Oxide Semiconductor Field Effect Transistors" Journal of Applied Physics, Vol. 94, No.6 pp 4102-4107, (2003).
     
  11. Rona E. Belford, Wei Zhao, Jim Potashnik, Qingmin Liu, and Alan Seabaugh, "Performance Augmented CMOS Using Back-End Uniaxial Strain" Device Research Conference, 60th DRC. 24-26 June 2002, Conference Digest Page(s): 41 - 42. (2002).
     
  12. R E Belford, "Uniaxial, Tensile Strained-Si Devices ", Journal of Electronic Mataterials, Special Issue on Alternative Substrate Technology, Vol. 30, No.7, (2001).

Publication of industrial sponsored research is restricted

Conference Presentations

  1. Sumant Sood and Rona Belford, "Strained silicon via plasma enhanced dCTE bonding", International Symposium on Semiconductor Wafer Bonding, Cancun Mexico,  Oct/ Nov 2006.
     
  2. Rona Belford, Qing Xu, Sumant Sood, Antonio Acosta, Alan Thrift, Jordan Zell, Lloyd Bosworth, “Novel Process Combining SOI and Strained Circuitry", 2006 IEEE International SOI Conference, New York, poster presentation, Oct 2-5 2006.
     
  3. Sumant Sood and Rona Belford, "Surface Activation Using Remote Plasma for a New Wafer Bonding Route to Strained-Si", 209th Electrochemical Society Meeting Denver, May 2006.
     
  4. Rona Belford, "No Strain, No Gain", invited paper, IEEE International Electron Device Materials Colloquium, Orlando, Feb 2006.
     
  5. Rona E. Belford, Wei Zhao, Jim Potashnik, Qingmin Liu, and Alan Seabaugh, "Performance Augmented CMOS Using Back-End Uniaxial Strain" Device Research Conference, June 2002.
     
  6. Rona E. Belford, 5th Space and Missile Defense Conference, Aug 2002.
     
  7. Rona E. Belford, "Strained Si Compliant Substrates", invited paper, International Conference on Alternative Substrate Technology, Lake Tahoe Jan 2001.
     

Publications of industrial sponsored research is restricted