Sumant Sood currently leads the National Science Foundation project team at Belford Research and is investigating semiconductor wafer bonding processes for Germanium-free strained silicon on Insulator (sSOI) applications. Previously, he held positions at Nutech Systems, Technology Applications Inc. and Advanced Materials Processing & Analysis Center (AMPAC) at University of Central Florida where he developed semiconductor processes to be used in cryogenic applications. His past experience includes process development  using electronic, ceramic and polymer materials for microelectronics, thin films deposition,  etching of metals and dielectrics, semiconductors materials characterization and programming using NI LabVIEW and MatLAB. Sumant is a member of  IEEE, International Microelectronics & Packaging Society (IMAPS), Electrochemical Society and American Vacuum Society. He received his B.Tech in Electrical Engineering and  MS in Microelectronics from University of Central Florida.